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Electron Backscatter Diffraction (EBSD)

  • APEX™ Software
    APEX Software for EBSD

    EDAX APEX™ EBSD enables the characterization of electron backscatter diffraction (EBSD) patterns within the user-friendly APEX software platform.

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  • Orientation Imaging Microscopy (OIM) Analysis™
    OIM Analysis

    EDAX OIM Analysis™ is the premier microstructural visualization and analysis tool for interrogating and understanding electron backscatter diffraction (EBSD) mapping data.

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  • Clarity™ EBSD Analysis System
    Clarity EBSD Detector Series

    The world’s first and only commercially available electron backscatter diffraction (EBSD) detector with unparalleled performance as low as 3 kV. This direct detection system is ideal for beam-sensitive perovskite, ceramic, or semiconductor materials that are difficult to analyze using conventional EBSD systems.

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  • Velocity™ EBSD Camera
    Velocity EBSD Camera Series

    The EDAX Velocity™ EBSD camera series offers high-speed electron backscatter diffraction (EBSD) mapping with the best indexing performance on real-world materials.

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  • Neighbor Pattern Averaging & Reindexing (NPAR™)
    Neighbor Pattern Averaging & Reindexing (NPAR)

    EDAX NPAR™, or Neighbor Pattern Averaging & Reindexing, is an innovative approach to measuring crystallographic orientation from electron backscatter diffraction (EBSD) patterns.

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  • OIM Matrix™
    OIM Matrix

    The EDAX OIM Matrix™ software package, offered as an optional module for OIM Analysis™, allows users to simulate electron backscatter diffraction (EBSD) patterns based on the physics of the dynamical diffraction of electrons.

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  • Pattern Region of Interest Analysis System (PRIAS™)
    Pattern Region of Interest Analysis System (PRIAS)

    The EDAX Pattern Region of Interest Analysis System (PRIAS™) is a synergistic new approach for imaging and visualizing a material’s microstructural features.

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  • Atom Probe Assist
    Atom Probe Assist

    EDAX Atom Probe Assist provides an innovative means of monitoring grain boundary position between FIB milling steps to ensure that a grain boundary is detected and correctly positioned for subsequent atom probe analysis.

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