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- Introduction to Orientation Imaging Microscopy (OIM™)
OIM™ Data Collection is a proven analytical tool for the collection of high quality EBSD data at high speeds. OIM™ is used by both high end researchers and plant quality control specialists: all interested in having a flexible, yet powerful tool to effectively analyze their materials.
- DigiView IV Detector
DigiView IV is the latest member of the EDAX Electron Backscatter Diffraction (EBSD) series of detectors and is designed to serve a range of EBSD applications.
Using the DigiView IV in combination with EDAX’s OIM™ software, the detector can obtain orientation mapping data at rates up to 150 indexed patterns per second with indexing success rates of greater than 99%. The DigiView IV can also be used for Phase Identification using the Genesis and Delphi software applications. The detector can produce high resolution images up to 1392 x 1040 pixels.
- OIM™ 3D EBSD Wizard
The 3D Wizard provides step by step direction to set up and perform 3D Data Collection through a single interface that combines functions from an ion-electron beam SEM, the TSL EBSD detector, and Orientation Imaging Microscopy (OIM™) software. The 3D Wizard guides the user through the set up of the field of interest, the selection of milling templates, and the entry of critical parameters as required.
- Hough Transforms
The bands in patterns are identified using advanced image analysis and complex Fourrier Transforms, called Houghs. The good news is that modern EBSD systems perform these calculations for you. However, some detailed information about Hough Transforms is provided.
- Triplet Indexing
Diffraction patterns are indexed within the OIM™ software using the unique and powerful Triplet Voting algorithms. This is a superior method of pattern solution only requires a few bands to find a solution and is able to effectively solve partial patterns, faint patterns, difficult to solve patterns from worked materials, and overlapping patterns at grain boundaries.
- Patented Confidence Index
EDAX-TSL's patented Confidence Index provides the user a parameter that indicates how well a particular solution is a match versus the next best solution. The CI is only available from EDAX-TSL, and should not be confused with the fit parameter, which describes to what degree a single possible solution "fits" the pattern.
- Multiphase Analysis (Chi-scan)
The EBSD-EDS Multiphase Analysis software provides significant advantages over other analytical methods to positively determine the phase content of a material. The user gets the power of OIM™ and the addition of EDS elemental data, in one combined analysis.
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